ChipDesign

SERVICES & TURN-KEY SOLUTIONS PRODUCTS OPEN-SOURCE SOFTWARE PATENTS & PUBLICATIONS CONTACT

ChipDesign offers following services & turn-key solutions:

IC design

ChipDesign offers front-to-back mixed-signal / RFIC design services in triple-well bulk and twin-well PD- and FD-SOI/SOS CMOS processes (interested in FinFET), covering IC specification, design, layout, functional verification, packaging and characterization. In addition, ChipDesign also provides antenna and antenna array, IC package (BGA/LGA, DVN/QFN, SOT, WLCSP), capacitive and piezoelectric MEMS device (accelerometers, gyroscopes, inertial measurement units, microphones, resonators, switches), and MMIC (power amplifiers based on III-V compound semiconductors such as GaAs, GaN, and InP) design services, as well as electronic design automation services. ChipDesign has access to state-of-the-art technologies (through MOSIS) and EDA tools (through Cadence).

Specialties:

Turn-key solutions

ChipDesign also offers turn-key RF solutions to customers. Examples include: